Connectors for High Density Applications

Connectors for High Density Applications

Amphenol FCI has released 0.8mm connectors for high density applications. The BergStak Lite series is a parallel board-to-board connector system with sixteen PCB stack heights in four sizes. The housing and terminal profile supports up to 12Gbps and the gold flash plating supports 50 mating cycles for lower mating cycle application.

These connectors are available in forty to hundred position sizes in twenty position increments and 5mm to 20mm stack heights in 1mm increments. They are compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights.