Housed within a single BGA package, the Octavo Systems OSD335x-SM is a robust system-in-package (SiP) that is based upon the 1GHz ARM Cortex-A8 Sitara processor. It also features a DDR3 memory resource, two power supplies, plus numerous passive components. This level of integration accelerates design cycles and removes the need for complicated DDR routing and power sequencing. The BGA package design enables a 60% reduction in board real estate compared to an equivalent discrete component approach. A full industrial temperature range, covering -40°C to 85°C, is supported.